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Conductive Brush Ring overcomes current leakage in EV powertrains

SKF's new Conductive Brush Ring paves the way to greater reliability and longer life in high-performance electric vehicle powertrain systems. Using pure carbon fiber bristles, it provides a reliable electrical connection between an EV eAxle rotor shaft and its housing. When used in combination with SKF Hybrid ceramic ball bearings, it helps to alleviate parasitic current effects that can lead to premature failure in bearings and other components. Available in different configurations for wet (oil-lubricated) motor designs -- and soon for dry (sealed) applications.
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Intro to reed switches, magnets, magnetic fields

This brief introductory video on the DigiKey site offers tips for engineers designing with reed switches. Dr. Stephen Day, Ph.D. from Coto Technology gives a solid overview on reed switches -- complete with real-world application examples -- and a detailed explanation of how they react to magnetic fields.
View the video.

Bi-color LEDs to light up your designs

Created with engineers and OEMs in mind, SpectraBright Series SMD RGB and Bi-Color LEDs from Visual Communi-cations Company (VCC) deliver efficiency, design flexibility, and control for devices in a range of industries, including mil-aero, automated guided vehicles, EV charging stations, industrial, telecom, IoT/smart home, and medical. These 50,000-hr bi-color and RGB options save money and space on the HMI, communicating two or three operating modes in a single component.
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All about slip rings: How they work and their uses

Rotary Systems has put together a really nice basic primer on slip rings -- electrical collectors that carry a current from a stationary wire into a rotating device. Common uses are for power, proximity switches, strain gauges, video, and Ethernet signal transmission. This introduction also covers how to specify, assembly types, and interface requirements. Rotary Systems also manufactures rotary unions for fluid applications.
Read the overview.

Seifert thermoelectric coolers from AutomationDirect

Automation-Direct has added new high-quality and efficient stainless steel Seifert 340 BTU/H thermoelectric coolers with 120-V and 230-V power options. Thermoelectric coolers from Seifert use the Peltier Effect to create a temperature difference between the internal and ambient heat sinks, making internal air cooler while dissipating heat into the external environment. Fans assist the convective heat transfer from the heat sinks, which are optimized for maximum flow.
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EMI shielding honeycomb air vent panel design

Learn from the engineering experts at Parker how honeycomb air vent panels are used to help cool electronics with airflow while maintaining electromagnetic interference (EMI) shielding. Topics include: design features, cell size and thickness, platings and coatings, and a stacked design called OMNI CELL construction. These vents can be incorporated into enclosures where EMI radiation and susceptibility is a concern or where heat dissipation is necessary. Lots of good info.
Read the Parker blog.

What is 3D-MID? Molded parts with integrated electronics from HARTING

3D-MID (three-dimensional mechatronic integrated devices) technology combines electronic and mechanical functionalities into a single, 3D component. It replaces the traditional printed circuit board and opens up many new opportunities. It takes injection-molded parts and uses laser-direct structuring to etch areas of conductor structures, which are filled with a copper plating process to create very precise electronic circuits. HARTING, the technology's developer, says it's "Like a PCB, but 3D." Tons of possibilities.
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Loss-free conversion of 3D/CAD data

CT CoreTech-nologie has further developed its state-of-the-art CAD converter 3D_Evolution and is now introducing native interfaces for reading Solidedge and writing Nx and Solidworks files. It supports a wide range of formats such as Catia, Nx, Creo, Solidworks, Solidedge, Inventor, Step, and Jt, facilitating smooth interoperability between different systems and collaboration for engineers and designers in development environments with different CAD systems.
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Top 5 reasons for solder joint failure

Solder joint reliability is often a pain point in the design of an electronic system. According to Tyler Ferris at ANSYS, a wide variety of factors affect joint reliability, and any one of them can drastically reduce joint lifetime. Properly identifying and mitigating potential causes during the design and manufacturing process can prevent costly and difficult-to-solve problems later in a product lifecycle.
Read this informative ANSYS blog.

Advanced overtemp detection for EV battery packs

Littelfuse has introduced TTape, a ground-breaking over-temperature detection platform designed to transform the management of Li-ion battery systems. TTape helps vehicle systems monitor and manage premature cell aging effectively while reducing the risks associated with thermal runaway incidents. This solution is ideally suited for a wide range of applications, including automotive EV/HEVs, commercial vehicles, and energy storage systems.
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Benchtop ionizer for hands-free static elimination

EXAIR's Varistat Benchtop Ionizer is the latest solution for neutralizing static on charged surfaces in industrial settings. Using ionizing technology, the Varistat provides a hands-free solution that requires no compressed air. Easily mounted on benchtops or machines, it is manually adjustable and perfect for processes needing comprehensive coverage such as part assembly, web cleaning, printing, and more.
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LED light bars from AutomationDirect

Automation-Direct adds CCEA TRACK-ALPHA-PRO series LED light bars to expand their offering of industrial LED fixtures. Their rugged industrial-grade anodized aluminum construction makes TRACKALPHA-PRO ideal for use with medium to large-size industrial machine tools and for use in wet environments. These 120 VAC-rated, high-power LED lights provide intense, uniform lighting, with up to a 4,600-lumen output (100 lumens per watt). They come with a standard bracket mount that allows for angle adjustments. Optional TACLIP mounts (sold separately) provide for extra sturdy, vibration-resistant installations.
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World's first metalens fisheye camera

2Pi Optics has begun commercial-ization of the first fisheye camera based on the company's proprietary metalens technology -- a breakthrough for electronics design engineers and product managers striving to miniaturize the tiny digital cameras used in advanced driver-assistance systems (ADAS), AR/VR, UAVs, robotics, and other industrial applications. This camera can operate at different wavelengths -- from visible, to near IR, to longer IR -- and is claimed to "outperform conventional refractive, wide-FOV optics in all areas: size, weight, performance, and cost."
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Orbex offers two fiber optic rotary joint solutions

Orbex Group announces its 700 Series of fiber optic rotary joint (FORJ) assemblies, supporting either single or multi-mode operation ideal for high-speed digital transmission over long distances. Wavelengths available are 1,310 or 1,550 nm. Applications include marine cable reels, wind turbines, robotics, and high-def video transmission. Both options feature an outer diameter of 7 mm for installation in tight spaces. Construction includes a stainless steel housing.
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Mini tunnel magneto-resistance effect sensors

Littelfuse has released its highly anticipated 54100 and 54140 mini Tunnel Magneto-Resistance (TMR) effect sensors, offering unmatched sensitivity and power efficiency. The key differentiator is their remarkable sensitivity and 100x improvement in power efficiency compared to Hall Effect sensors. They are well suited for applications in position and limit sensing, RPM measurement, brushless DC motor commutation, and more in various markets including appliances, home and building automation, and the industrial sectors.
Learn more.

Engineers boost computer processor performance by over 20%

By Matt Shipman, NC State

Researchers from North Carolina State University have developed a new technique that allows graphics processing units (GPUs) and central processing units (CPUs) on a single chip to collaborate – boosting processor performance by an average of more than 20%.

"Chip manufacturers are now creating processors that have a ‘fused architecture,' meaning that they include CPUs and GPUs on a single chip," says Dr. Huiyang Zhou, an associate professor of electrical and computer engineering who co-authored a paper on the research. "This approach decreases manufacturing costs and makes computers more energy efficient. However, the CPU cores and GPU cores still work almost exclusively on separate functions. They rarely collaborate to execute any given program, so they aren't as efficient as they could be. That's the issue we're trying to resolve."

GPUs were initially designed to execute graphics programs, and they are capable of executing many individual functions very quickly. CPUs, or the "brains" of a computer, have less computational power – but are better able to perform more complex tasks.

"Our approach is to allow the GPU cores to execute computational functions, and have CPU cores pre-fetch the data the GPUs will need from off-chip main memory," Zhou says.

"This is more efficient because it allows CPUs and GPUs to do what they are good at. GPUs are good at performing computations. CPUs are good at making decisions and flexible data retrieval."

In other words, CPUs and GPUs fetch data from off-chip main memory at approximately the same speed, but GPUs can execute the functions that use that data more quickly. So, if a CPU determines what data a GPU will need in advance, and fetches it from off-chip main memory, that allows the GPU to focus on executing the functions themselves – and the overall process takes less time.

In preliminary testing, Zhou's team found that its new approach improved fused processor performance by an average of 21.4%.

This approach has not been possible in the past, Zhou adds, because CPUs and GPUs were located on separate chips.

The paper, "CPU-Assisted GPGPU on Fused CPU-GPU Architectures," will be presented Feb. 27 at the 18th International Symposium on High Performance Computer Architecture in New Orleans. The paper was co-authored by NC State Ph.D. students Yi Yang and Ping Xiang, and by Mike Mantor of Advanced Micro Devices (AMD). The research was funded by the National Science Foundation and AMD.

Published February 2012

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